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基于ADSP-BF70x Blackfin处理器系列开发方案详解

电子工程师 来源:互联网 作者:工程师陈翠 2018-06-07 00:30 次阅读

ADI公司ADSP-BF70x Blackfin处理器系列采用双MAC 16位最新的处理引擎,正交RISC微处理器指令集,在单指令架构中采用单指令多数据(SIMD)多媒体功能, Blackfin+核能工作高达400MHz,每周妻支持双16位或单32位MAC,其低功耗性能可应用在汽车电子视频/图像分析,工业控制,马达控制,仪器仪表电源控制和生物计量。本文介绍了ADSP-BF70x Blackfin处理器系列主要特性,框图和Blackfin+处理核框图,以及评估板ADSP-BF707 EZ-KIT Lite 主要特性,框图,电路图,材料清单和PCB布局设计图。

The ADSP-BF70x processor is a member of the Blackfin family of products. The Blackfin processor combines a dual- MAC 16-bit state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities into a single instruction-set architecture. New enhancements to the Blackfin+ core add 32-bit MAC and 16-bit complex MAC support, cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products. The processor offers performance up to 400 MHz, as well as low static power consumption. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance. By integrating a rich set of industry-leading system peripherals and memory (shown in Table 1), the Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and power/motor control applications.

ADSP-BF70x Blackfin处理器系列主要特性:

Blackfin+ core with up to 400 MHz performance

Dual 16-bit or single 32-bit MAC support per cycle

16-bit complex MAC and many other instruction set enhancements

Instruction set compatible with previous Blackfin products

Low-cost packaging

88-Lead LFCSP (QFN) package (12 mm × 12mm),  RoHS compliant

184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant

Low system power with 《 100 mW total device power at 400 MHz (《 0.25 mW/MHz) at 25°C TJUNCTION

MEMORY

136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)

Large on-chip L2 SRAM with ECC protection 256KB, 512KB, 1MB variants

On-chip L2 ROM (512KB) L3 interface (CSP_BGA only) optimized for lowest system power, providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz)

Security and one-time-programmable memory

Crypto hardware accelerators

Fast secure boot for IP protection

memDMA encryption/decryption for fast run-time security

基于ADSP-BF70x Blackfin处理器系列开发方案详解

图1. ADSP-BF70x Blackfin处理器系列框图

BLACKFIN+ PROCESSOR CORE

As shown in Figure 1, the processor integrates a Blackfin+ processor core. The core, shown in Figure 2, contains two 16-bit multipliers, one 32-bit multiplier, two 40-bit accumulators (which may be used together as a 72-bit accumulator), two 40- bit ALUs, one 72-bit ALU, four video ALUs, and a 40-bit shifter. The computation units process 8-, 16-, or 32-bit data from the register file. The compute register file contains eight 32-bit registers. When performing compute operations on 16-bit operand data, the register file operates as 16 independent 16-bit registers. All operands for compute operations come from the multiported register file and instruction constant fields. The core can perform two 16-bit by 16-bit multiply-accumu-lates or one 32-bit multiply-accumulate in each cycle. Signed and unsigned formats, rounding, saturation, and complex mul-tiplies are supported. The ALUs perform a traditional set of arithmetic and logical operations on 16-bit or 32-bit data. In addition, many special instructions are included to accelerate various signal processing tasks. These include bit operations such as field extract and pop-ulation count, divide primitives, saturation and rounding, and sign/exponent detection. The set of video instructions include byte alignment and packing operations,  16-bit and 8-bit adds with clipping, 8-bit average operations, and 8-bit subtract/absolute value/accumulate (SAA) operations. Also provided are the compare/select and vector search instructions. For certain instructions, two 16-bit ALU operations can be per-formed simultaneously on register pairs (a 16-bit high half and 16-bit low half of a compute register)。 If a second ALU is used, quad 16-bit operations are possible. The 40-bit shifter can perform shifts and rotates and is used to support normalization, field extract, and field deposit instructions

基于ADSP-BF70x Blackfin处理器系列开发方案详解

图2. ADSP-BF70x Blackfin+处理器核框图

评估板ADSP-BF707 EZ-KIT Lite

Thank you for purchasing the ADSP-BF707 EZ-KIT Lite®, Analog Devices, Inc. low-cost evaluation system for the ADSP-BF70x Blackfin® processors.

The ADSP-BF707 processor is a member of the Blackfin family of products. Blackfin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD)multimedia capabilities into a single instruction-set architecture. New enhancements to the Blackfin+™ core add 32-bit MAC and 16-bit complex MAC support, cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.

The EZ-KIT Lite is shipped with all of the necessary hardware—you can start the evaluation immediately. The package contains the standalone evaluation board, CE-approved power supply, and USB cable. The EZ-KIT Lite version ships with an ICE-1000 emulator, while the EZ-Board® version is supported by the ICE-1000 or ICE-2000 emulator.Expansion Interface III is provided for connecting a camera or audio extender board.

Traditional mechanical switches for changing the board’s factory setup have been removed in favor of I2C controlled software switches. The only remaining mechanical switches are the boot mode switch and push buttons.

The evaluation board is designed to be used in conjunction with the CrossCore® Embedded Studio (CCES) development tools to test capabilities of the ADSP-BF707 Blackfin processors. The CCES development environment aids advanced application code development and debug, such as:

Create, compile, assemble, and link application programs written in C++, C, and assembly

Load, run, step, halt, and set breakpoints in application programs

Read and write data and program memory

Read and write core and peripheral registers

评估板ADSP-BF707 EZ-KIT Lite 主要特性:

Analog Devices ADSP-BF707 processor

184-ball BGA package

25 MHz CLKIN core oscillator

DDR2 memory (DMC0) chip

128M x 16-bit (2G bit)

Micron MT47H128M16

Quad SPI Flash (SPI2)

32M bit serial flash memory

Winbond W25Q32

RF Wireless

4 x 2 connector

0.05” socket

Universal Asynchronous Receiver/Transmitter (UART0)

FTDI FT232RQ USB to UART converter

USB Mini B connector

Controller Area Network (CAN) interfaces

CAN0—NXP TJA1041 transceiver and RJ11 connector

CAN1—NXP TJA1041 transceiver and RJ11 connector

USB0 interface

Micro AB connector

HADC

VIN0 RTC battery through jumper

VIN1 timer through RC

VIN2 0.1” header

VIN3 0.1” header

RTC

16MM coin connector

3V 125 mAh Li-ion

CR1632

RESET controller

Analog Devices ADM6315 microprocessor supervisory circuits

Debug (JTAG/SWD/TRACE) interface

JTAG/SWD/SWO 10-pin 0.05” header for use with ADI emulators

TRACE/JTAG/SWD 38-pin Mictor header

Power measurement

INA3221 to measure 3V, VDD_INT and VDD_EXT

INA230 to measure VDD_DMC0

LEDs

Six LEDs: one power (green), one board reset (red), one SYS_FAULT (red), and three general-purpose (amber)

Push buttons

Three push buttons: one reset and two IRQ/Flag

Expansion Interface III connectors (EI3)

SMC0

PPI

SPORT

SPI

UART

TWI

TMR

GPIOs

PWR_IN

GND/3.3V output

External power supply

CE compliant

5V @ 3.6 Amps

Other features

SD/MMC memory connector

Boot mode switch

0.05-ohm resistors for processor current measurement


图3. 评估板ADSP-BF707 EZ-KIT Lite外形图

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图4. 评估板ADSP-BF707 EZ-KIT Lite框图

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图5. 评估板ADSP-BF707 EZ-KIT Lite电路图(1)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图6. 评估板ADSP-BF707 EZ-KIT Lite电路图(2)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图7. 评估板ADSP-BF707 EZ-KIT Lite电路图(3)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图8. 评估板ADSP-BF707 EZ-KIT Lite电路图(4)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图9. 评估板ADSP-BF707 EZ-KIT Lite电路图(5)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图10. 评估板ADSP-BF707 EZ-KIT Lite电路图(6)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图11. 评估板ADSP-BF707 EZ-KIT Lite电路图(7)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图12. 评估板ADSP-BF707 EZ-KIT Lite电路图(8)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图13. 评估板ADSP-BF707 EZ-KIT Lite电路图(9)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图14. 评估板ADSP-BF707 EZ-KIT Lite电路图(10)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图15. 评估板ADSP-BF707 EZ-KIT Lite电路图(11)

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图16. 评估板ADSP-BF707 EZ-KIT Lite电路图(12)
评估板ADSP-BF707 EZ-KIT Lite材料清单:

基于ADSP-BF70x Blackfin处理器系列开发方案详解

基于ADSP-BF70x Blackfin处理器系列开发方案详解

基于ADSP-BF70x Blackfin处理器系列开发方案详解

基于ADSP-BF70x Blackfin处理器系列开发方案详解

基于ADSP-BF70x Blackfin处理器系列开发方案详解

基于ADSP-BF70x Blackfin处理器系列开发方案详解

基于ADSP-BF70x Blackfin处理器系列开发方案详解

基于ADSP-BF70x Blackfin处理器系列开发方案详解


图17. 评估板ADSP-BF707 EZ-KIT Lite PCB元件布局图:顶层

基于ADSP-BF70x Blackfin处理器系列开发方案详解

图18. 评估板ADSP-BF707 EZ-KIT Lite PCB元件布局图:底层

更详细的评估板ADSP-BF707 EZ-KIT Lite PCB布局设计图见:

评估板ADSP-BF707 EZ-KIT Lite PCB布局设计图.pdf

声明:本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人,不代表电子发烧友网立场。文章及其配图仅供工程师学习之用,如有内容侵权或者其他违规问题,请联系本站处理。 举报投诉
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