Characterizing and Modeling the Impact of Power/Ground Via Arrays on Power Pl

2009-7-1 18:03:56 3501

0 Characterizing and Modeling the Impact of Power/Ground Via Arrays on Power Plane Impedance Abstract In this paper, the impact of power/ground via arrays on power plane impedance is studied. 8 x 8 via array structures are characterized and the results are compared to fullwave field simulation using HFSS. These results show that the impedance and effective inductance is a strong function of location within the array. The lowest impedance is found on the array perimeter and the impedance is several times higher in the array center. The impact antipad size and dielectric thickness on the plane impedance and inductance is examined using parameterized models. 39P39kEa.pdf (210.98 KB, 下载次数: 0 ) 0
举报淘帖0 只看该作者相关推荐 • leakage power是指什么 2457 • 为什么leakage power如此重要 2052 • PADS Power基础教程 1887 • Warning: You are connecting digital power to analog ground. 4497 • CAPTURE TO POWER PCB 2252 • CAPTURE TO POWER PCB 1803 • Power Supply and Ground Design for a WiFi Transceiver 2801 • Lag compensation errors in active power filters based on DSP controllers… 1284 • External-Sync Power Supply 3593 • CAPTURE TO POWER PCB 7428