是否应该为EEPROM添加散热片

散热片只有在（a）环境温度低于85摄氏度且（b）芯片本身由于其产生的热量而高于85摄氏度时才有用。
在这种情况下，散热器将使芯片温度更接近环境温度，并且足够大的散热器（和/或风扇）将使其保持在85°C以下。如果环境温度高于85°C，则没有散热器/风扇将使芯片温度低于85°C
- 这样做会违反热力学定律。
有效的热泵（例如TEC）会，但这将需要更多的功率和更多的冷却。绝对最大额定值定义了损坏发生之前的限制。
低于85degC，该设备将工作。
在85°C和125°C之间，设备无法工作，但不会损坏。
高于125摄氏度，设备可能会永久性损坏。我建议更换为不同的闪存芯片。
Spartan 6支持Atmel（现在的Adesto）DataFlash芯片，提供105degC和125degC两种版本。
在原帖中查看解决方案



以下为原文

Heatsinks will only help if (a) ambient temperature is below 85degC and (b) the chip itself goes above 85degC due to the heat it generates. In this case a heatsink will bring the chip temperature closer to ambient, and a sufficiently large heatsink (and/or fan) will keep it below 85degC.

If ambient is above 85degC, then no heatsink/fan is going to get the chip below 85degC - doing so would violate the laws of thermodynamics. An active heat pump (eg. a TEC) would, but that would demand more power and even more cooling.

The absolute maximum rating defines the limit before damage will occur. Below 85degC the device will work. Between 85degC and 125degC the device won't work, but it won't be damaged. Above 125degC the device may be permanently damaged.

I suggest changing to a different flash chip. The Atmel (now Adesto) DataFlash chips are supported on the Spartan 6, and available in both 105degC and 125degC variants.
View solution in original post

散热片只有在（a）环境温度低于85摄氏度且（b）芯片本身由于其产生的热量而高于85摄氏度时才有用。
在这种情况下，散热器将使芯片温度更接近环境温度，并且足够大的散热器（和/或风扇）将使其保持在85°C以下。如果环境温度高于85°C，则没有散热器/风扇将使芯片温度低于85°C
- 这样做会违反热力学定律。
有效的热泵（例如TEC）会，但这将需要更多的功率和更多的冷却。绝对最大额定值定义了损坏发生之前的限制。
低于85degC，该设备将工作。
在85°C和125°C之间，设备无法工作，但不会损坏。
高于125摄氏度，设备可能会永久性损坏。我建议更换为不同的闪存芯片。
Spartan 6支持Atmel（现在的Adesto）DataFlash芯片，提供105degC和125degC两种版本。



以下为原文

Heatsinks will only help if (a) ambient temperature is below 85degC and (b) the chip itself goes above 85degC due to the heat it generates. In this case a heatsink will bring the chip temperature closer to ambient, and a sufficiently large heatsink (and/or fan) will keep it below 85degC.

If ambient is above 85degC, then no heatsink/fan is going to get the chip below 85degC - doing so would violate the laws of thermodynamics. An active heat pump (eg. a TEC) would, but that would demand more power and even more cooling.

The absolute maximum rating defines the limit before damage will occur. Below 85degC the device will work. Between 85degC and 125degC the device won't work, but it won't be damaged. Above 125degC the device may be permanently damaged.

I suggest changing to a different flash chip. The Atmel (now Adesto) DataFlash chips are supported on the Spartan 6, and available in both 105degC and 125degC variants.

高手，
100C环境（气温）？
这超出了规范，因为工业设备是100 C结温，而不是环境（环境）。
Austin Lesea主要工程师Xilinx San Jose



以下为原文

ace,
 
100C environment (air temperature)?  That is out of specification as out industrial device is 100 C junction temperature, not environment (ambient).
 
 
Austin Lesea
Principal Engineer
Xilinx San Jose

嗨u4223374，
谢谢你的回复。
我们会根据您的建议找到不同的EEPROM。
最好的祝福，
- 王牌



以下为原文

Hi u4223374,
 
Thank you for the helpful reply.
We will find a different EEPROM as you suggested.
 
Best Regards,
-- ace

嗨奥斯汀，是100C意味着气温。
感谢您的确认。在这种情况下，我们会为这种环境找到更适合的设备。最好的问候，
- 王牌



以下为原文

Hi Austin,

Yes 100C means air temperature. Thank you for the confirmation.
We will find a better suited device for this environment in this case.

Best Regards,-- ace

高手，
FPGA的工业温度范围也不起作用。
您将需要军用级设备（125 C交界处）。
Austin Lesea主要工程师Xilinx San Jose



以下为原文

Ace,
 
The industrial temp range for the FPGA won't work either.  You will require the military grade device (125 C junction).
 
 
Austin Lesea
Principal Engineer
Xilinx San Jose