[经验]

灵活的混合电子产品的可制造性

2018-10-17 15:07:32

1262 安森美传感器电源

美国国防部长阿什顿卡特最近宣布，总部位于圣何塞的FlexTech联盟将领导一个新的柔性混合电子制造创新研究所（FHE-MII）。
该中心将汇集能够将柔性混合电子产品商业化的大学研究人员和企业，这是一种在柔性基板上集成薄硅电子，传感元件，通信和电源的新兴制造能力。
安森美半导体很高兴被纳入该研究所的FlexTech提案。
灵活的混合电子设备具有许多国防部感兴趣的潜在应用，包括能够将柔性结构完整性传感器直接印刷到飞机表面上，或者为具有人体皮肤完全灵活性的受伤士兵开发智能假肢。
但考虑到可穿戴设备和物联网的影响，卡特司长还强调“商业应用将变革，即使不是更多，”也是如此。
他举例说明了智能绷带可以识别患者汗液和可拉伸传感器中的感染生物标志物，这些传感器可以放在桥上以监测金属疲劳。
他还指出，***历来通过资助研究，如GPS，或最近谷歌的自动驾驶汽车和苹果公司的虚拟助手Siri，推动了硅谷的全新创新。
FlexTech联盟的FHE-MII提案包括96家公司，11家实验室和非营利组织，42所大学以及14个州和地区组织的意见。
国防部将在五年内向FHE-MII提供7500万美元，并与来自非联邦资源的超过9600万美元的成本分摊相匹配。
该研究所是奥巴马总统建立的第七个制造业创新研究所，并加入其他研究所，专注于3D打印，轻金属和集成光子学等领域。
灵活的混合电子产品将应用于广泛的市场，包括汽车，通信，消费电子，医疗设备，物联网，运输以及军事/航空航天。
安森美半导体期待与FlexTech合作，因为它将组件和系统制造商与学术研究人员聚集在一起，探索安森美半导体参与的许多市场中的特定新兴机会。

以上来自于谷歌翻译

以下为原文

U.S. Secretary of Defense Ashton Carter recently announced that the San Jose based FlexTech Alliance would lead a new Manufacturing Innovation Institute for Flexible Hybrid Electronics (FHE-MII).  This center will bring together university researchers and businesses capable of commercializing flexible hybrid electronics, an emerging manufacturing capability of integrating thin silicon electronics, sensing elements, communications, and power on flexible substrates. ON Semiconductor was pleased to be included in the FlexTech proposal for the institute.
Flexible hybrid electronics has many potential applications of interest to the Defense Department, including enabling the printing of flexible structural integrity sensors right onto the surfaces of aircraft, or developing smart prosthetics for wounded soldiers that have the full flexibility of human skin.  But Secretary Carter also emphasized that “the commercial applications will be just as transformative, if not more so,” given the impact of wearables and the Internet-of-Things.  He cited as examples smart bandages that can identify infection biomarkers in a patient’s sweat and stretchable sensors that can be put on bridges to monitor metal fatigue.  He also noted that government has historically helped spur ground-up innovation in Silicon Valley by funding research that grew into technologies like GPS, or more recently Google’s self-driving cars and Apple’s virtual assistant Siri.

The FlexTech Alliance’s FHE-MII proposal included input from 96 companies, 11 laboratories and non-profits, 42 universities, and 14 state and regional organizations.  The Defense Department will provide the FHE-MII with $75 million over a five-year period and is being matched by more than $96 million in cost sharing from non-federal sources.  The Institute is the seventh Manufacturing Innovation Institute established by President Obama, and joins other institutes focused on areas like 3D printing, lightweight metals, and integrated photonics.
Flexible hybrid electronics will have applications in a wide array of markets including automotive, communications, consumer electronics, medical devices, Internet of Things, and transportation as well as military/aerospace.  ON Semiconductor is looking forward to working with FlexTech as it brings together component and system manufacturers with academic researchers to explore specific new and exciting opportunities in many of the markets in which ON Semiconductor participates.